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The time to read the first bit of memory from a DRAM without an active row is T RCD + CL. Row Precharge Time T RP: The minimum number of clock cycles required between issuing the precharge command and opening the next row. The time to read the first bit of memory from a DRAM with the wrong row open is T RP + T RCD + CL. Row Active Time T RAS
A 16GB [1] DDR4 SO-DIMM module by Micron. DDR4 memory is supplied in 288-pin dual in-line memory modules (DIMMs), similar in size to 240-pin DDR3 DIMMs. DDR4 RAM modules feature pins that are spaced more closely at 0.85 mm compared to the 1.0 mm spacing in DDR3, allowing for a higher pin density within the same standard DIMM length of 133.35 mm ...
Double data rate (DDR) RAM performs two transfers per clock cycle, and it is usually described by this transfer rate. Because the CAS latency is specified in clock cycles, and not transfers (which occur on both the rising and falling edges of the clock), it is important to ensure it is the clock rate (half of the transfer rate) which is being ...
A memory rank is a set of DRAM chips connected to the same chip select, which are therefore accessed simultaneously. In practice all DRAM chips share all of the other command and control signals, and only the chip select pins for each rank are separate (the data pins are shared across ranks).
The memory is divided into several equally sized but independent sections called banks, allowing the device to operate on a memory access command in each bank simultaneously and speed up access in an interleaved fashion. This allows SDRAMs to achieve greater concurrency and higher data transfer rates than asynchronous DRAMs could.
A module of any particular size can therefore be assembled either from 32 small chips (36 for ECC memory), or 16(18) or 8(9) bigger ones. DDR memory bus width per channel is 64 bits (72 for ECC memory). Total module bit width is a product of bits per chip and number of chips. It also equals number of ranks (rows) multiplied by DDR memory bus width.
Refreshing does not employ the normal memory operations (read and write cycles) used to access data, but specialized cycles called refresh cycles which are generated by separate counter circuits and interspersed between normal memory accesses. [5] [6] The storage cells on a memory chip are laid out in a rectangular array of rows and columns.
Also like SDRAM, the command sent on the cycle that CKE is first dropped selects the power-down state: If the chip is active, it freezes in place. If the command is a NOP (CS low or CA0–2 = HHH), the chip idles. If the command is a refresh command (CA0–2 = LLH), the chip enters the self-refresh state.