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The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets , graphics cards ...
A small blower fan is used to direct air across a laptop computer's CPU cooler. A case fan may be mounted on a radiator attached to the case, simultaneously operating to cool a liquid cooling device's working fluid and to ventilate the case. In laptops, a single blower fan often cools a heat sink connected to both CPU and GPU using heat pipes.
Radial Heat Sink with Thermal Profile and Swirling Forced Convection Flow Trajectories (using CFD analysis) Pin Fin Heat Sink with Thermal Profile and Dione Convection Flow Trajectories (using CFD analysis) Heat sink in a workstation computer An artist's impression of a motherboard heat sink, rendered using POV-Ray Free convection ...
Computer cooling is a sub-topic. Heat sinks are devices that are used to extend the surface area of electronic components available for air cooling, helping to lower the components case temperature. Fans are used to increase the air flow.
Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP ...
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A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
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