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This allows consumers to easily identify the Socket through the chipset name. Socket AM3+ supports solely Bulldozer (microarchitecture)-based FX-processors. In support of AM3+ CPUs, AMD has validated the 9-Series chipset for use with HyperTransport 3.1 (up to 6.4 GT/s). They also worked with NVIDIA to bring SLI support to this chipset series. [1]
A Trusted Platform Module (TPM) is a secure cryptoprocessor that implements the ISO/IEC 11889 standard. Common uses are verifying that the boot process starts from a trusted combination of hardware and software and storing disk encryption keys. A TPM 2.0 implementation is part of the Windows 11 system requirements. [1]
AM3+ socket support AMD 990X chipset RD980 2600 (HT 3.0) x8 + x8 x8 + x8 14 Two PCIe 2.0 x16, IOMMU. AM3+ socket support AMD 990FX chipset RD990 x16 + x16 or x8 quad x16 + x16 or x16 + x8 + x8 or x8 quad 19.6 Four PCIe 2.0 x16, IOMMU. AM3+ socket support Model Code name Released CPU support Fab (nm) HT (MHz) AMD-V (Hardware Virtualization) IGP ...
Socket FM1; CPU: K10 (also Husky or K10.5) cores with an upgraded Stars architecture, no L3 cache L1 cache: 64 KB Data per core and 64 KB Instruction cache per core; L2 cache: 512 KB on dual-core, 1 MB on tri- and quad-core models
Socket AM3 processors are able to run on Socket AM2 and AM2+ motherboards with appropriate BIOS updates, but not vice versa. AM3 processors have a new memory controller supporting both DDR2 and DDR3 SDRAM, allowing backwards compatibility with AM2 and AM2+ motherboards. Since AM2 and AM2+ processors lack the new memory controller, they will not ...
The static chain of trust starts when the platform powers on (or the platform is reset), which resets all PCRs to their default value. For server platforms, the first measurement is made by hardware (i.e., the processor) to measure a digitally signed module (called an Authenticated Code Module or ACM) provided by the chipset manufacturer.
AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt AMD APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and ...
Zen 3 is the name for a CPU microarchitecture by AMD, released on November 5, 2020. [2] [3] It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. [4]