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One very common positive photoresist used with the I, G and H-lines from a mercury-vapor lamp is based on a mixture of diazonaphthoquinone (DNQ) and novolac resin (a phenol formaldehyde resin). DNQ inhibits the dissolution of the novolac resin, but upon exposure to light, the dissolution rate increases even beyond that of pure novolac.
The term comes from Swedish "lack" for lacquer and Latin "novo" for new, since these materials were envisioned to replace natural lacquers such as copal resin. Typically novolaks are prepared by the condensation of phenol or a mixture of p- and m-cresol with formaldehyde (as formalin). The reaction is acid catalyzed.
Such photoresists are used in the manufacture of semiconductors. [2] [3] [4] In this application DNQs are mixed with Novolac resin, a type of phenolic polymer. The DNQ functions as a dissolution inhibitor. During the masking/patterning process, portions of the photoresist film are exposed to light while others remain unexposed.
Positive photoresists are composed of a novolac resin, ethyl lactate solvent, and Diazonaphthaquinone (DQ) as the photoactive compound. [9] Positive photoresist reacts with light to cause the polymer to break down and become soluble in a developer solution. Positive resist has better resistance to etchant than negative photoresist.
At this point the resin is a 3-dimensional network, which is typical of polymerised phenolic resins. The high crosslinking gives this type of phenolic resin its hardness, good thermal stability, and chemical imperviousness. Resoles are referred to as "one step" resins as they cure without a cross linker unlike novolacs, a "two step" resin.
Left: individual linear polymer chains Right: Polymer chains which have been cross linked to give a rigid 3D thermoset polymer. In materials science, a thermosetting polymer, often called a thermoset, is a polymer that is obtained by irreversibly hardening ("curing") a soft solid or viscous liquid prepolymer (). [1]
SU-8 is a commonly used epoxy-based negative photoresist. Negative refers to a photoresist whereby the parts exposed to UV become cross-linked, while the remainder of the film remains soluble and can be washed away during development. As shown in the structural diagram, SU-8 derives its name from the presence of 8 epoxy groups.
In 2009 it was a new technique for circuit manufacturing using both photoresists and high refractive index fluids. The photoresist needs to have an n value of greater than 1.90. It has been shown that non-aromatic, sulfur-containing HRIPs are the best materials for an optical photoresist system.