Search results
Results from the WOW.Com Content Network
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, [1] is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads.
A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules; [1] in the latter case, they may be referred to as microbumps (μbumps ...
After Top Gear allegedly refused to drive it because "they thought it couldn't clear a speed bump", Ultima Sports, Ltd. drove the car from Surrey to the track and set the time, verified by Plans Motorsport. [23] 1:13.2 – McLaren P1 tested by Motor Trend 2014; 1:13.6 – Nissan ZEOD RC pure-electric vehicle mode. [22] 1:14.2 – Ferrari LaFerrari.
Maize (Zea mays, Poaceae) is the most widely cultivated C 4 plant.[1]In botany, C 4 carbon fixation is one of three known methods of photosynthesis used by plants. C 4 plants increase their photosynthetic efficiency by reducing or suppressing photorespiration, which mainly occurs under low atmospheric CO 2 concentration, high light, high temperature, drought, and salinity.
A wafer-level package attached to a printed-circuit board. Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced.
Small, itchy bumps: These may be red, white, or yellow and can appear around the hair follicles. They can be mistaken for acne. Pain or tenderness: The affected areas might be sore or painful to ...
Bumpless Build-up Layer (BBUL) is a processor packaging technology developed by Intel.It is bumpless, because it does not use the usual tiny solder bumps to attach the silicon die to the processor package wires.