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A chip scale atomic clock (CSAC) is a compact, low-power atomic clock fabricated using techniques of microelectromechanical systems (MEMS) and incorporating a low-power semiconductor laser as the light source. The first CSAC physics package was demonstrated at the National Institute of Standards and Technology in 2003, [1] based on an invention ...
In semiconductor manufacturing, the 2 nm process is the next MOSFET (metal–oxide–semiconductor field-effect transistor) die shrink after the 3 nm process node.. The term "2 nanometer", or alternatively "20 angstrom" (a term used by Intel), has no relation to any actual physical feature (such as gate length, metal pitch or gate pitch) of the transistors.
Toshiba TLCS-12, a microprocessor developed for the Ford EEC (Electronic Engine Control) system in 1973. [11] Intel 8080 CPU launched in 1974 was manufactured using this process. [96] The Television Interface Adaptor, the custom graphics and audio chip developed for the Atari 2600 in 1977. [97]
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In August 2004, NIST scientists demonstrated a chip-scale atomic clock that was 100 times smaller than an ordinary atomic clock and had a much smaller power consumption of 125 mW. [ 33 ] [ 34 ] The atomic clock was about the size of a grain of rice with a frequency of about 9 GHz.
Products included hydrogen masers, rubidium and cesium atomic standards, temperature and oven controlled crystal oscillators, miniature and chip scale atomic clocks, network time servers, network sync management systems, cable timekeeping solutions, telecom synchronization supply units (SSUs), and timing test sets.
Kitching's research focuses on the development of compact devices and instruments that combine elements of precision atomic spectroscopy, silicon micromachining and photonics. In the early 2000s, he and his group pioneered the development of chip-scale atomic clocks and magnetometers based on a patent [ 5 ] filed with the USPTO in 2001.
Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. [1] Flat no-lead packages usually, but not always, include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB).