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  2. TO-220 - Wikipedia

    en.wikipedia.org/wiki/TO-220

    The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more.

  3. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  4. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    TO-126: Plastic-encapsulated package with three leads and a hole for mounting on a heat sink; TO-220: Through-hole plastic package with a (usually) metal heat sink tab and three leads; TO-226 [23] TO-247: [24] Plastic-encapsulated package with three leads and a hole for mounting on a heat sink

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    Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!

  6. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  7. TO-3 - Wikipedia

    en.wikipedia.org/wiki/TO-3

    The case is used with high-power and high-current devices, on the order of a few tens of amperes current and up to a hundred watts of heat dissipation. The case surfaces are metal for good heat conductivity and durability. The metal-to-metal and metal-to-glass joints provide hermetic seals that protect the semiconductor from liquids and gases.

  8. Template:Convert/list of units - Wikipedia

    en.wikipedia.org/wiki/Template:Convert/list_of_units

    For a complete list of all dimensions, see full list of units. {{Convert}} uses unit-codes , which are similar to, but not necessarily exactly the same as, the usual written abbreviation for a given unit.

  9. Forward converter - Wikipedia

    en.wikipedia.org/wiki/Forward_converter

    A schematic showing the most important components of a forward converter. ATX PC Power Supply with Forward Converter (heat sinks are removed for better view) The forward converter is a DC/DC converter that uses a transformer to increase or decrease the output voltage (depending on the transformer ratio) and provide galvanic isolation for the ...

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