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Semiconductor device fabrication. 1.5 μm – 1981. Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM).
Process design kit. A process design kit (PDK) is a set of files used within the semiconductor industry to model a fabrication process for the design tools used to design an integrated circuit. The PDK is created by the foundry defining a certain technology variation for their processes. It is then passed to their customers to use in the design ...
Integrated circuit design, semiconductor design, chip designor IC design, is a sub-field of electronics engineering, encompassing the particular logicand circuit designtechniques required to design integrated circuits, or ICs. ICs consist of miniaturized electronic componentsbuilt into an electrical networkon a monolithic semiconductorsubstrate ...
Microfabrication is the process of fabricating miniature structures of micrometre scales and smaller. Historically, the earliest microfabrication processes were used for integrated circuit fabrication, also known as "semiconductor manufacturing" or "semiconductor device fabrication". In the last two decades, microelectromechanical systems (MEMS ...
Very-large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining millions or billions of MOS transistors onto a single chip. VLSI began in the 1970s when MOS integrated circuit (Metal Oxide Semiconductor) chips were developed and then widely adopted, enabling complex semiconductor and telecommunications technologies.
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. The packaging stage is followed by testing of the ...
Through-silicon via. In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits.
Figure 1: Functional flow block diagram format. [ 1 ] A functional flow block diagram (FFBD) is a multi-tier, time-sequenced, step-by-step flow diagram of a system 's functional flow. [ 2 ] The term "functional" in this context is different from its use in functional programming or in mathematics, where pairing "functional" with "flow" would be ...