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In a radio receiver circuit, the RF front end, short for radio frequency front end, is a generic term for all the circuitry between a receiver's antenna input up to and including the mixer stage. [1] It consists of all the components in the receiver that process the signal at the original incoming radio frequency (RF), before it is converted to ...
pSemi (formerly Peregrine Semiconductor), is a San Diego–based manufacturer of high-performance RF (radio frequency) CMOS integrated circuits.A Murata Manufacturing company since December 2014, the company's products are used in aerospace and defense, broadband, industrial, mobile wireless device, test and measurement equipment and wireless infrastructure markets. [2]
Illustration of FEOL (device generation in the silicon, bottom) and BEOL (depositing metalization layers, middle part) to connect the devices. CMOS fabrication process. The front end of line (FEOL) is the first portion of IC fabrication where the individual components (transistors, capacitors, resistors, etc.) are patterned in a semiconductor substrate. [1]
Atheros Intellon 1200 AFE-Chip as companion for an INT 5500 PowerLine-IC. An analog front-end (AFE or analog front-end controller AFEC) is a set of analog signal conditioning circuitry that uses sensitive analog amplifiers, often operational amplifiers, filters, and sometimes application-specific integrated circuits for sensors, radio receivers, and other circuits to provide a configurable and ...
Nordic Semiconductor ASA (formerly known as Nordic VLSI) was founded in 1983 and is a Norwegian fabless technology company with its headquarters in Trondheim, Norway.The company specializes in designing ultra-low-power wireless communication semiconductors and supporting software for engineers developing and manufacturing Internet of Things (IoT) products.
This mini environment is within an EFEM (equipment front end module) [8] which allows a machine to receive FOUPs, and introduces wafers from the FOUPs into the machine. Additionally many machines also handle wafers in clean nitrogen or vacuum environments to reduce contamination and improve process control. [ 3 ]
IPDs (IPCs) Single SMT chip solutions for Bandpass, Lowpass, HighPass, and other combinations based on LC, RC etc. integrated networks on a ceramic substrate Integrated passives (resistors and capacitors) on high resistive silicon substrate coated by thick silicon dioxide Active IC flipped as face down on the integrated passive substrate enabling 2D integration Example of RF IPD balun on Glass ...
NASTRAN was designed from the beginning to consist of several modules. A module is a collection of FORTRAN subroutines designed to perform a specific task—processing model geometry, assembling matrices, applying constraints, solving matrix problems, calculating output quantities, conversing with the database, printing the solution, and so on.