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CAD (top) and stainless steel laser-cut part (bottom) Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and hobbyists. Laser cutting works by directing the output of a high ...
Plasma cutting is a process that cuts through electrically conductive materials by means of an accelerated jet of hot plasma. Typical materials cut with a plasma torch include steel, stainless steel, aluminum, brass and copper, although other conductive metals may be cut as well. Plasma cutting is often used in fabrication shops, automotive ...
Laser beam machining (LBM) is a form of machining that uses heat directed from a laser beam. This process uses thermal energy to remove material from metallic or nonmetallic surfaces. The high frequency of monochromatic light will fall on the surface, thus heating, melting and vaporizing the material due to the impinge of photons (see Coulomb ...
A water jet cutter, also known as a water jet or waterjet, is an industrial tool capable of cutting a wide variety of materials using an extremely high-pressure jet of water, or a mixture of water and an abrasive substance. The term abrasive jet refers specifically to the use of a mixture of water and an abrasive to cut hard materials such as ...
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] Die singulation comes after the photolithography process. It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
The metal is heated and burnt by the laser beam, cutting the metal sheet. [20] The quality of the edge can be mirror smooth and a precision of around 0.1 mm (0.0039 in) can be obtained. Cutting speeds on thin 1.2 mm (0.047 in) sheet can be as high as 25 m (82 ft) per minute.
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