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Laser cutting. Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and hobbyists. Laser cutting works by directing the output of a high-power laser most commonly through optics.
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] Die singulation comes after the photolithography process. It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
Laser beam machining (LBM) is a form of machining that uses heat directed from a laser beam. This process uses thermal energy to remove material from metallic or nonmetallic surfaces. The high frequency of monochromatic light will fall on the surface, thus heating, melting and vaporizing the material due to the impinge of photons (see Coulomb ...
The metal is heated and burnt by the laser beam, cutting the metal sheet. [20] The quality of the edge can be mirror smooth and a precision of around 0.1 mm (0.0039 in) can be obtained. Cutting speeds on thin 1.2 mm (0.047 in) sheet can be as high as 25 m (82 ft) per minute.
Metal fabrication is the creation of metal structures by cutting, bending and assembling processes. It is a value-added [1] process involving the creation of machines, parts, and structures from various raw materials. Typically, a fabrication shop bids on a job, usually based on engineering drawings, and if awarded the contract, builds the product.
The laser cutter is a machine that uses a laser to cut materials such as chip board, matte board, felt, wood, and acrylic up to 3/8 inch (1 cm) thickness. The laser cutter is often bundled with a driver software which interprets vector drawings produced by any number of CAD software platforms. [5]
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