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A mechanical device test stand [1] is one specific type of test stand.It is a facility used to develop, characterize and test mechanical components. The facility allows for the testing of the component and, it offers measurement of several physical variables associated to the functionality of the component.
In semiconductor testing, the device under test is a die on a wafer or the resulting packaged part. A connection system is used, connecting the part to automatic or manual test equipment. The test equipment then applies power to the part, supplies stimulus signals, then measures and evaluates the resulting outputs from the device.
Mobile-device testing functions to assure the quality of mobile devices, like mobile phones, PDAs, etc. It is conducted on both hardware and software, and from the view of different procedures, the testing comprises R&D testing, factory testing and certificate testing.
Then, a periodic test will assure that the device has not become unsafe since the POST. Safety-critical devices normally define a "safety interval", a period of time too short for injury to occur. The self test of the most critical functions normally is completed at least once per safety interval. The periodic test is normally a subset of the POST.
Electronic test equipment is used to create signals and capture responses from electronic devices under test (DUTs). In this way, the proper operation of the DUT can be proven or faults in the device can be traced. Use of electronic test equipment is essential to any serious work on electronics systems.
The Java Device Test Suite has approximately 11,000 tests that can be extended with new tests written by Sun engineers or by others, including users of the test suite. Users can choose to run any combination of tests, according to the features supported by a device and available resources, and make use of framework features:
Test method: There are two main ways of testing mobile applications: testing on real devices or testing on emulators. [6] Emulators often miss issues that can only be caught by testing on real devices, but because of the multitude of different devices in the market, real devices can be expensive to purchase and time-consuming to use for testing.
Wafer testing is a step performed during semiconductor device fabrication after back end of line (BEOL) and before IC packaging.. Two types of testing are typically done. Very basic wafer parametric tests (WPT) are performed at a few locations on each wafer to ensure the wafer fabrication process has been carried out successfully.