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In electronics, a wafer (also called a slice or substrate) [1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon
Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in a semiconductor device fabrication process. Examples include production of radio frequency amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer ...
[52] [53] Bridge tools were used in the transition from 150 mm wafers to 200 mm wafers [54] and in the transition from 200 mm to 300 mm wafers. [55] [56] The semiconductor industry has adopted larger wafers to cope with the increased demand for chips as larger wafers provide more surface area per wafer. [57]
The wafers are a crucial component of advanced semiconductors and part of the US to award Taiwan's GlobalWafers up to $400 million to boost US semiconductor wafer production Skip to main content
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw ) [ 2 ] or laser cutting .
A robot in the wafer loader picks up one of the wafers from the cassette and loads it onto the wafer stage where it is aligned to enable another, finer alignment process that will occur later on. The pattern of the circuitry for each chip is contained in a pattern etched in chrome on the reticle, which is a plate of transparent quartz .
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