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All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset. Includes integrated RDNA2 GPU with 2 CUs and base, boost clock speeds of 0.4 GHz, 2.2 GHz. L1 cache: 80 KB (48 KB data + 32 KB instruction) per core. L2 cache: 1 MB per core. Fabrication process: TSMC N4 FinFET (N6 FinFET for the I/O die).
The Ryzen family is an x86-64 microprocessor family from AMD, based on the Zen microarchitecture.The Ryzen lineup includes Ryzen 3, Ryzen 5, Ryzen 7, Ryzen 9, and Ryzen Threadripper with up to 96 cores.
Zen 5 is the name for a CPU microarchitecture by AMD, shown on their roadmap in May 2022, [3] launched for mobile in July 2024 and for desktop in August 2024. [4] It is the successor to Zen 4 and is currently fabricated on TSMC 's N4X process. [ 5 ]
Architecture Fabrication (nm) Family Release Date Code name Model Group Cores SMT Clock rate () Bus Speed & Type [a] Cache Socket Memory Controller Features L1 L2
Concrete products are codenamed "Llano": List of AMD accelerated processing units. Llano AMD Fusion ( K10 cores + Redwood -class GPU) (launch Q2 2011, this is the first AMD APU) uses Socket FM1 Bulldozer architecture; Bulldozer, Piledriver, Steamroller, Excavator (2011–2017)
As of Packet Tracer 5.0, Packet Tracer supports a multi-user system that enables multiple users to connect multiple topologies together over a computer network. [6] Packet Tracer also allows instructors to create activities that students have to complete. [citation needed] Packet Tracer is often used in educational settings as a learning aid.
AMD Zen 3+ Family 19h – 2022 revision of Zen 3 used in Ryzen 6000 mobile processors using a 6 nm process. AMD Zen 4 Family 19h – fourth generation Zen architecture, in 5 nm process. [5] Used in Ryzen 7000 consumer processors on the new AM5 platform with DDR5 and PCIe 5.0 support. Adds support for AVX-512 instruction set. AMD Zen 5 Family ...
Zen 4 is the name for a CPU microarchitecture designed by AMD, released on September 27, 2022. [4] [5] [6] It is the successor to Zen 3 and uses TSMC's N6 process for I/O dies, N5 process for CCDs, and N4 process for APUs. [7]