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As an epoxy modifier it is classed as an epoxy reactive diluent. [8] It is one of a family of glycidyl ethers available used for viscosity reduction of epoxy resins. [9] These are then further formulated into coatings, sealants, adhesives, and elastomers. [10] [11] Resins with this diluent tend to show improved workability. [12]
A no. 8 ("mirror") finish requires polishing and buffing compounds, and polishing wheels attached to high speed polishing machines or electric drills. Lubricants like wax and kerosene [ 4 ] may be used as lubricating and cooling media during these operations, although some polishing materials are specifically designed to be used "dry."
Epoxy is the family of basic components or cured end products of epoxy resins. Epoxy resins, also known as polyepoxides, are a class of reactive prepolymers and polymers which contain epoxide groups. The epoxide functional group is also collectively called epoxy. [1] The IUPAC name for an epoxide group is an oxirane.
Polishing is the process of creating a smooth and shiny surface by rubbing it or by applying a chemical treatment, leaving a clean surface with a significant specular reflection (still limited by the index of refraction of the material according to the Fresnel equations). [1]
A table green wood-stained and varnished with three layers of polyurethane varnish. Polyurethane varnishes are typically hard, abrasion-resistant, and durable coatings. They are popular for hardwood floors but are considered by some wood finishers to be difficult or unsuitable for finishing furniture or other detailed pieces. Polyurethanes are ...
Ceramic fixtures are being more commonly glazed with 2 part epoxy compounds. The first component is a clear or opaque resin combined with a catalyst or hardener. The proper procedure requires that the nonporous fixture be sand blasted to create a rough surface for the epoxy primer to adhere to. Once the primer has dried the topcoat is applied.
Bisphenol S (BPS, dioxydiphenylsulfone) is an organic compound with the formula (HOC 6 H 4) 2 SO 2. It has two phenol functional groups on either side of a sulfonyl group. It is commonly used in curing fast-drying epoxy resin adhesives. It is classified as a bisphenol, and a close molecular analog of bisphenol A (BPA).
Chemical mechanical polishing (CMP) (also called chemical mechanical planarization) is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing. [ 1 ]
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