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  2. Adhesive bonding of semiconductor wafers - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding_of...

    Adhesive bonding with organic materials such as BCB or SU-8 has simple process properties and the ability to form high-aspect ratio micro structures. The bonding procedure is based on polymerization reaction of organic molecules to form long polymer chains during annealing. This cross-link reaction forms BCB and SU-8 to a solid polymer layer. [3]

  3. Caesium chloride - Wikipedia

    en.wikipedia.org/wiki/Caesium_chloride

    The caesium chloride structure adopts a primitive cubic lattice with a two-atom basis, where both atoms have eightfold coordination. The chloride atoms lie upon the lattice points at the corners of the cube, while the caesium atoms lie in the holes in the center of the cubes; an alternative and exactly equivalent 'setting' has the caesium ions at the corners and the chloride ion in the center.

  4. Adhesive bonding - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding

    Adhesive bonding is a joining technique used in the manufacture and repair of a wide range of products. Along with welding and soldering, adhesive bonding is one of the basic joining processes. In this technique, components are bonded together using adhesives. The broad range of types of adhesives available allows numerous materials to be ...

  5. Caesium azide - Wikipedia

    en.wikipedia.org/wiki/Caesium_azide

    Caesium carbonate can also be used as the base: Cs 2 CO 3 + HN 3 → CsN 3 + CO 2 + H 2 O. Caesium sulfate reacts with barium azide to form insoluble barium sulfate and caesium azide: Cs 2 SO 4 + Ba(N 3) 2 → 2CsN 3 + BaSO 4 ↓. The thermal decomposition of CsN 3 in vacuo can be used as a method of generating high purity caesium metal: [5] 2 ...

  6. Solvent bonding - Wikipedia

    en.wikipedia.org/wiki/Solvent_bonding

    Solvent bonding differs from adhesive bonding, because the solvent does not become a permanent addition to the joined substrate. [4] Solvent bonding differs from other plastic welding processes in that heating energy is generated by the chemical reaction between the solvent and thermoplastic, and cooling occurs during evaporation of the solvent ...

  7. Coordination number - Wikipedia

    en.wikipedia.org/wiki/Coordination_number

    For chemical compounds with regular lattices such as sodium chloride and caesium chloride, a count of the nearest neighbors gives a good picture of the environment of the ions. In sodium chloride each sodium ion has 6 chloride ions as nearest neighbours (at 276 pm) at the corners of an octahedron and each chloride ion has 6 sodium atoms (also ...

  8. Release agent - Wikipedia

    en.wikipedia.org/wiki/Release_agent

    Release agents are coated onto some plastic films to prevent adhesives from bonding to the plastic surface. Some release agents, also known as de-molding agent, form oil, parting agent or form releaser, are substances used in molding and casting that aid in the separation of a mould from the material being moulded and reduce imperfections in ...

  9. Impact glue - Wikipedia

    en.wikipedia.org/wiki/Impact_glue

    Impact glue, contact glue, contact cement, or neoprene glue is a type of solvent-based adhesive which may be used to bond materials such as plastics, laminates, and metal or wood veneers. [1] The term "contact glue" come from the practice of applying adhesive to both surfaces to be bonded; the surfaces are joined once the solvent in the ...

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