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3D Cross Point 2 layer diagram Intel Optane in M.2 card format. 3D XPoint (pronounced three-D cross point) is a discontinued non-volatile memory (NVM) technology developed jointly by Intel and Micron Technology. It was announced in July 2015 and was available on the open market under the brand name Optane (Intel) from April 2017 to July 2022. [1]
IM Flash Technologies, LLC was the semiconductor company founded in January 2006, by Intel Corporation and Micron Technology, Inc. IM Flash produced 3D XPoint used in data centers and high end computers. It had a 300mm wafer fab in Lehi, Utah, United States.
In 2017, Intel launched the 900P series Optane SSDs based on 3D XPoint technology as opposed to NAND flash memory. The price and speed of Optane memory is between that of DRAM and NAND. Prices are 2x-5x that of SSDs at announcement with significantly reduced latency. [22]
Micron (MU) is seeking buyers for its Utah factory as it quits from making 3D XPoint memory chips to shift focus on developing CXL-enabled memory products.
3D XPoint is a type of non-volatile memory technology developed by Intel and Micron, announced in 2015. [74] It operates by changing the electrical resistance of materials in its cells, offering much faster access times than NAND flash. 3D XPoint-based SSDs, such as Intel’s Optane drives, provide lower latency and higher endurance than NAND ...
Intel and Micron have released in 2017, then discontinued in 2022, the 3D XPoint PCM technology, but it never was sold in DIMM format, contrary to announcements. [8] Sony and Viking Technology have announced an NVDIMM-N product based on the ReRAM technology, [9] but it never reached the market.
The only current memory technology that easily competes with MRAM in terms of performance at comparable density is static random-access memory (SRAM). SRAM consists of a series of transistors arranged in a flip-flop, which will hold one of two states as long as power is applied. Since the transistors have a very low power requirement, their ...
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