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A heat sink (aluminum) with its heat pipes (copper) and fan (black) A heat sink (also commonly spelled heatsink, [1]) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of ...
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
The Socket AM2, renamed from Socket M2 (to prevent using the same name as Cyrix MII processors), is a CPU socket designed by AMD for desktop processors, including the performance, mainstream and value segments. It was released on May 23, 2006, as a replacement for Socket 939.
A small blower fan is used to direct air across a laptop computer's CPU cooler. A case fan may be mounted on a radiator attached to the case, simultaneously operating to cool a liquid cooling device's working fluid and to ventilate the case. In laptops, a single blower fan often cools a heat sink connected to both CPU and GPU using heat pipes.
Noctua is an Austrian computer hardware manufacturer of CPU coolers and computer fans with a primary focus on the enthusiast market. The company's inception occurred in 2005 through a joint venture partnership between the Austrian company Rascom Computer distribution Ges.m.b.H., established in August 2000, [2] and the Taiwanese cooling specialist Kolink International Corporation.
Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high ...
A radiator is more efficient than a standard CPU or GPU heatsink/air cooler at removing heat because it has a much larger surface area. Installation of a water block is also similar to that of a heatsink, with a thermal pad or thermal grease placed between it and the device being cooled to aid in heat conduction. [clarification needed]
This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power ( TDP ), also known as thermal design point , is the maximum amount of heat that a computer component (like a CPU , GPU or system on a chip ) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo ...
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