Search results
Results from the WOW.Com Content Network
Dye penetrant inspection (DP), also called liquid penetrate inspection (LPI) or penetrant testing (PT), is a widely applied and low-cost inspection method used to check surface-breaking defects in all non-porous materials (metals, plastics, or ceramics).
This method (liquid penetrant testing) (PT) involves using dyes, fluorescent or colored (typically red), suspended in fluids and is used for non-magnetic materials, usually metals. Analyzing and documenting a nondestructive failure mode can also be accomplished using a high-speed camera recording continuously (movie-loop) until the failure is ...
Liquid penetrant inspection of non-magnetic aircraft metal parts. Fluorescent penetrant inspection (FPI) is a type of dye penetrant inspection in which a fluorescent dye is applied to the surface of a non-porous material in order to detect defects that may compromise the integrity or quality of the part in question. FPI is noted for its low ...
Dye penetrant inspection or liquid penetrant inspection, an inspection method used to locate surface-breaking defects in all non-porous materials; Lysinuric protein intolerance, an autosomal recessive metabolic disorder affecting amino acid transport; Leaf plastochron index, a measure of plant leaf age based on morphological development
Liquid Penetrant Testing (dye check) can verify minor defects. Magnetic Particle Inspection can discover Slag inclusions and cracks just below the surface. Deeper defects can be detected using Radiographic (X-rays) and/or Ultrasound (sound waves) testing techniques.
Common inspection methods for steel castings are magnetic particle testing and liquid penetrant testing. [33] Common inspection methods for aluminum castings are radiography, ultrasonic testing, and liquid penetrant testing. [34]
The Barbie went on sale at 9 p.m. PT on Wednesday (midnight Thursday ET) and was only available to members of a subscription-paying Barbie collectors group on the site. It was also on sale on ...
Dye-n-Pry is a useful technique in which a dye penetrant material is used to inspect for interconnect failures in integrated circuits (ICs). This is mostly commonly done on solder joints for ball grid array (BGA) components, although in some cases it can be done with other components or samples. The component of interest is submerged in a dye ...