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eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The main driving force behind the eWLB technology was to allow fanout and more space for interconnect routing. All process steps for the generation of the package are performed on the wafer.
Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still ...
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By contrast, in standard WLP flows integrated circuits are packaged while still part of the wafer, and the wafer (with outer layers of packaging already attached) is diced afterwards; the resulting package is practically of the same size as the die itself. However, the advantage of having a small package comes with a downside of limiting the ...
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The initials WLP may stand for several things, such as the following: Wafer-level packaging, a type of integrated circuit (microchip) packaging; Weakest liberal precondition, a computer programming concept; WebSphere Liberty Profile, a computer software version; Windows Logo Program, a Microsoft Windows branding and certification program
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Tailed-primers include non-complementary sequences at their 5' ends. A common procedure is the use of linker-primers, which ultimately place restriction sites at the ends of the PCR products, facilitating their later insertion into cloning vectors. An extension of the 'colony-PCR' method (above), is the use of vector primers.