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Kevlar (para-aramid) [2] is a strong, heat-resistant synthetic fiber, related to other aramids such as Nomex and Technora.Developed by Stephanie Kwolek at DuPont in 1965, [3] [2] [4] the high-strength material was first used commercially in the early 1970s as a replacement for steel in racing tires.
Same as the small molecular liquid crystal, liquid crystal polymers also have different mesophases. The mesogen cores of the polymers will aggregate into different mesophases: nematics, cholesterics, smectics and compounds with highly polar end groups. [10] More information about the mesophases can be found on liquid crystal page.
Kevlar: Para-aramid fibre: High tensile strength: Manufacturing armour, sports and musical equipment. Used in the field of cryogenics: Twaron: Para-aramid: Heat resistant and strong fibre: Bullet-proof body armor, helmets, brake pads, ropes, cables and optical fibre cables, etc. and as an asbestos substitute Mylar: Polyethylene terephthalate film
Although typically "doping" conductive polymers involves oxidizing or reducing the material, conductive organic polymers associated with a protic solvent may also be "self-doped." Undoped conjugated polymers are semiconductors or insulators. In such compounds, the energy gap can be > 2 eV, which is too great for thermally activated conduction.
This material which must have started out like unfired pottery was slip cast from fused silica. Then it was dried four days at 333 K before being tested. It was 9 inches in diameter and 1 inch thick, density 1.78 ⋅ cm −3. The first run went to 1317K and then on the second run the same insulator proved to be more conductive. 1959. [110 ...
Liquid armor is a material under research by defense institutions and universities around the world including the United States Army Research Laboratory (ARL). [ 1 ] [ 2 ] [ 3 ] Some of the earliest research in this area was performed at Massachusetts Institute of Technology [ 4 ] and University of Delaware [ 5 ] in 2003.
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
Thermal contact conductance is an important factor in a variety of applications, largely because many physical systems contain a mechanical combination of two materials. Some of the fields where contact conductance is of importance are: [3] [4] [5] Electronics. Electronic packaging; Heat sinks; Brackets; Industry