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Fugacity and BCF relate to each other in the following equation: = [6] where Z Fish is equal to the Fugacity capacity of a chemical in the fish, P Fish is equal to the density of the fish (mass/length 3), BCF is the partition coefficient between the fish and the water (length 3 /mass) and H is equal to the Henry's law constant (Length 2 /Time 2) [6]
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Fluorescence-lifetime imaging microscopy or FLIM is an imaging technique based on the differences in the exponential decay rate of the photon emission of a fluorophore from a sample. It can be used as an imaging technique in confocal microscopy, two-photon excitation microscopy, and multiphoton tomography. The fluorescence lifetime (FLT) of the ...
The BIM Collaboration Format (BCF) is a structured file format suited to issue tracking with a building information model. The BCF is designed primarily for defining views of a building model and associated information on collisions and errors connected with specific objects in the view. The BCF allows users of different BIM software, and/or ...
Mean time between failures (MTBF) is the predicted elapsed time between inherent failures of a mechanical or electronic system during normal system operation. MTBF can be calculated as the arithmetic mean (average) time between failures of a system. The term is used for repairable systems while mean time to failure (MTTF) denotes the expected ...
Following a vegan diet for just eight weeks could reduce your biological age, new research shows. The study showed decreases in the ages of the participants’ heart, hormone, liver, and ...
Barlow's formula. Barlow's formula (called "Kesselformel" [ 1] in German) relates the internal pressure that a pipe [ 2] can withstand to its dimensions and the strength of its material . This approximate formula is named after Peter Barlow, an English mathematician. [ 3] where. : outside diameter.
Solder fatigue is the mechanical degradation of solder due to deformation under cyclic loading. This can often occur at stress levels below the yield stress of solder as a result of repeated temperature fluctuations, mechanical vibrations, or mechanical loads. Techniques to evaluate solder fatigue behavior include finite element analysis and ...