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Tape-automated bonding (TAB) is a process that places bare semiconductor chips (dies) like integrated circuits onto a flexible circuit board (FPC) by attaching them to fine conductors in a polyamide or polyimide (like trade names Kapton or UPILEX) film carrier. This FPC with the die(s) (TAB inner lead bonding, ILB) can be mounted on the system ...
This allows the tape to survive many thousands of passes over the tape heads without wearing away the oxide layer, which would otherwise have occurred in heavy swap file use on timesharing systems. The fundamental durability and reliability of DECtape was underscored when the design of the tape reel mounting hubs was changed in the early 1970s.
Wafer mounting is a step that is performed during the die preparation of a wafer as part of the process of semiconductor fabrication. During this step, the wafer is mounted on a plastic tape that is attached to a ring. Wafer mounting is performed right before the wafer is cut into separate dies. The adhesive film upon which the wafer is mounted ...
High voltage interface relays, a.k.a., interface relays: [1] [2] or coupling relays or insulating interfaces [3] [4] is a special class of electrical relays designed to provide informational and electrical compatibility between functional components isolated from each other and not allowing for a direct connection due to a high difference of potentials.
External connections on battery holders are usually made by contacts with pins, surface mount feet, solder lugs, or wire leads. Where the battery is expected to last over the life of the product, no holder is necessary, and a tab welded to the battery terminals can be directly soldered to a printed circuit board.
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The first insulation was asphalt-saturated cotton cloth, then rubber became common. Wire splices in such installations were twisted together for good mechanical strength, then soldered and wrapped with rubber insulating tape and friction tape (asphalt saturated cloth), or made inside metal junction boxes.