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The dynamic power (switching power) dissipated by a chip is C·V 2 ·A·f, where C is the capacitance being switched per clock cycle, V is voltage, A is the Activity Factor [1] indicating the average number of switching events per clock cycle by the transistors in the chip (as a unitless quantity) and f is the clock frequency.
Underclocking, also known as downclocking, is modifying a computer or electronic circuit's timing settings to run at a lower clock rate than is specified. Underclocking is used to reduce a computer's power consumption, increase battery life, reduce heat emission, and it may also increase the system's stability, lifespan/reliability and compatibility.
The dynamic power consumed by a CPU is approximately proportional to the CPU frequency, and to the square of the CPU voltage: [5] P d y n = C V 2 f {\displaystyle P_{dyn}=CV^{2}f} where C is the switched load capacitance, f is frequency, V is voltage.
Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).
Overclocking BIOS setup on an ABIT NF7-S motherboard with an AMD Athlon XP processor. Front side bus (FSB) frequency (external clock) has been increased from 133 MHz to 148 MHz, and the CPU clock multiplier factor has been changed from 13.5 to 16.5. This corresponds to an overclocking of the FSB by 11.3 percent and of the CPU by 36 percent.
An Intel November 2008 white paper [10] discusses "Turbo Boost" technology as a new feature incorporated into Nehalem-based processors released in the same month. [11]A similar feature called Intel Dynamic Acceleration (IDA) was first available with Core 2 Duo, which was based on the Santa Rosa platform and was released on May 10, 2007.
Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets , graphics cards ...
For example, a system with an external clock of 100 MHz and a 36x clock multiplier will have an internal CPU clock of 3.6 GHz. The external address and data buses of the CPU (often collectively termed front side bus (FSB) in PC contexts) also use the external clock as a fundamental timing base; however, they could also employ a (small) multiple ...