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Compression Attached Memory Module (CAMM) is a memory module form factor which uses a land grid array, and developed at Dell by engineer Tom Schnell as a replacement for DIMMs and SO-DIMMs which use edge connectors and had been in use for about 25 years. [1] The first SO-DIMMs were introduced by JEDEC in 1997. [2] [3] [4] [5]
The first production DDR5 DRAM chip was officially launched by SK Hynix on October 6, 2020. [13] [14] The separate JEDEC standard Low Power Double Data Rate 5 (LPDDR5), intended for laptops and smartphones, was released in February 2019. [15] Compared to DDR4, DDR5 further reduces memory voltage to 1.1 V, thus reducing power consumption. DDR5 ...
All models support up to 128 GB of RAM and up to 256 GB of DDR5 RAM after a BIOS upgrade. All models support DDR4 and DDR5 in dual-channel mode. [b] All models support up to DDR4-3200 or DDR5-4800. The i5-13600 (K/KF/T) and all models above it support DDR5 speeds up to 5600 MT/s with max 2 DIMMs slotted, 4400 MT/s if 4 DIMMs are slotted.
The following other wikis use this file: Usage on cs.wikipedia.org SO-DIMM; Usage on de.wikipedia.org Small Outline Dual Inline Memory Module; Usage on en.wikiversity.org
Assorted SO-DIMM Modules A 200-pin PC2-5300 DDR2 SO-DIMM. A 204-pin PC3-10600 DDR3 SO-DIMM. A SO-DIMM slot on a computer motherboard. A SO-DIMM (pronounced "so-dimm" / ˈ s oʊ d ɪ m /, also spelled "SODIMM") or small outline DIMM, is a smaller alternative to a DIMM, being roughly half the physical size of a regular DIMM. The first SODIMMs had ...
The number of chips is a multiple of 8 for non-ECC modules and a multiple of 9 for ECC modules. Chips can occupy one side (single sided) or both sides (dual sided) of the module. The maximal number of chips per DDR module is 36 (9×4) for ECC and 32 (8x4) for non-ECC. ECC vs non-ECC Modules that have error-correcting code are labeled as ECC.
Initial clock rates were 400 and 533 MHz, which are described as DDR3-800 and DDR3-1066 (PC3-6400 and PC3-8500 modules), but 667 and 800 MHz, described as DDR3-1333 and DDR3-1600 (PC3-10600 and PC3-12800 modules) are now common. [14] Performance up to DDR3-2800 (PC3 22400 modules) are available. [15]
The number of physical DRAMs depends on their individual widths. For example, a rank of ×8 (8-bit wide) DRAMs would consist of eight physical chips (nine if ECC is supported), but a rank of ×4 (4-bit wide) DRAMs would consist of 16 physical chips (18, if ECC is supported). Multiple ranks can coexist on a single DIMM.
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