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A very early CD4029A counter IC, in 16-pin ceramic dual in-line package (DIP-16), manufactured by RCA Colorized IC die and schematics of CD4011BE NAND gate. The 4000 series was introduced as the CD4000 COS/MOS series in 1968 by RCA [1] as a lower power and more versatile alternative to the 7400 series of transistor-transistor logic (TTL) chips.
The following is a list of CMOS 4000-series digital logic integrated circuits.In 1968, the original 4000-series was introduced by RCA.Although more recent parts are considerably faster, the 4000 devices operate over a wide power supply range (3V to 18V recommended range for "B" series) and are well suited to unregulated battery powered applications and interfacing with sensitive analogue ...
Download QR code; In other projects Appearance. ... English: Pinout of the 4017 decade counter IC. Inputs are green, outputs are blue and power pins are red. Date:
Articles with the IC number in the title use [[Category:IC objects|####]], dropping the IC prefix, and using only the number. The number should be padded up to 4 digits using zeroes. Articles without the IC number in the title use [[Category:IC objects]]. A redirect containing the IC number should also be added to the category, sorted as above.
A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC.. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage.
Layout view of a simple CMOS operational amplifier. In integrated circuit design, integrated circuit (IC) layout, also known IC mask layout or mask design, is the representation of an integrated circuit in terms of planar geometric shapes which correspond to the patterns of metal, oxide, or semiconductor layers that make up the components of the integrated circuit.
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In integrated circuit design, physical design is a step in the standard design cycle which follows after the circuit design.At this step, circuit representations of the components (devices and interconnects) of the design are converted into geometric representations of shapes which, when manufactured in the corresponding layers of materials, will ensure the required functioning of the components.