enow.com Web Search

  1. Ad

    related to: equipment front end module

Search results

  1. Results from the WOW.Com Content Network
  2. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    This mini environment is within an EFEM (equipment front end module) [8] which allows a machine to receive FOUPs, and introduces wafers from the FOUPs into the machine. Additionally many machines also handle wafers in clean nitrogen or vacuum environments to reduce contamination and improve process control. [ 3 ]

  3. Wafer fabrication - Wikipedia

    en.wikipedia.org/wiki/Wafer_fabrication

    Referred to respectively as the wafer fab equipment [2] or wafer front end [3] (equipment) market, both using the acronym WFE, the market is that of the manufacturers of the machines which in turn manufacture semiconductors.

  4. Semiconductor device - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device

    This mini environment is within an EFEM (equipment front end module) [14] which allows a machine to receive FOUPs, and introduces wafers from the FOUPs into the machine. Additionally many machines also handle wafers in clean nitrogen or vacuum environments to reduce contamination and improve process control. [ 9 ]

  5. Front end of line - Wikipedia

    en.wikipedia.org/wiki/Front_end_of_line

    Illustration of FEOL (device generation in the silicon, bottom) and BEOL (depositing metalization layers, middle part) to connect the devices. CMOS fabrication process. The front end of line (FEOL) is the first portion of IC fabrication where the individual components (transistors, capacitors, resistors, etc.) are patterned in a semiconductor substrate. [1]

  6. front end of line (FEoL) – initial wafer processing steps up to (but not including) metal interconnect (see also back end of line, far back end of line, post-fab) heterogeneous integration – combining different types of integrated circuitry into a single device; differences may be in fabrication process, technology node, substrate, or function

  7. ASM International - Wikipedia

    en.wikipedia.org/wiki/ASM_International

    ASM's products are used by semiconductor manufacturers in front-end wafer processing in their semiconductor fabrication plants. ASM's technologies include atomic layer deposition, epitaxy, chemical vapor deposition and diffusion. [1] The company was founded by Arthur del Prado (1931-2016) as 'Advanced Semiconductor Materials' in 1964. [2]

  8. International Technology Roadmap for Semiconductors - Wikipedia

    en.wikipedia.org/wiki/International_Technology...

    The International Technology Roadmap for Semiconductors (ITRS) is a set of documents that was coordinated and organized by Semiconductor Research Corporation [1] and produced by a group of experts in the semiconductor industry.

  9. Modular crate electronics - Wikipedia

    en.wikipedia.org/wiki/Modular_crate_electronics

    A crate is a box (chassis) that mounts in an electronics rack with an opening in the front facing the user. There are rails on the top and bottom of the crate that extend from the open (user) end to the back end of the crate. The back end of the crate contains power and data connectors that modules connect to.

  1. Ad

    related to: equipment front end module