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front end of line (FEoL) – initial wafer processing steps up to (but not including) metal interconnect (see also back end of line, far back end of line, post-fab) heterogeneous integration – combining different types of integrated circuitry into a single device; differences may be in fabrication process, technology node, substrate, or function
The steps involving testing and packaging of dies, followed by final testing of finished, packaged chips, are called the back end, [118] post-fab, [192] ATMP (Assembly, Test, Marking, and Packaging) [193] or ATP (Assembly, Test and Packaging) of semiconductor manufacturing, and may be carried out by OSAT (OutSourced Assembly and Test) companies ...
This internal atmosphere is known as a mini-environment and helps improve yield which is the amount of working devices on a wafer. This mini environment is within an EFEM (equipment front end module) [14] which allows a machine to receive FOUPs, and
The resulting completed flip chip assembly is much smaller than a traditional carrier-based system; the chip sits directly on the circuit board, and is much smaller than the carrier both in area and height. The short wires greatly reduce inductance, allowing higher-speed signals, and also conduct heat better.
Many equipment manufacturers in the industries of semiconductors (front end and back end), surface mount technology, electronics assembly, photovoltaics, flat panel displays and others provide a SECS/GEM interface so that the factory host software can communicate with the machine for monitoring and/or controlling purposes.
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A power module or power electronic module provides the physical containment for several power components, usually power semiconductor devices. These power semiconductors (so-called dies ) are typically soldered or sintered on a power electronic substrate that carries the power semiconductors, provides electrical and thermal contact and ...
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