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The following other wikis use this file: Usage on ca.wikipedia.org Solder ball; Usage on fa.wikipedia.org ساچمه لحیم; تراشه برگردان
Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.
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The clamshell form factor is based on the hinged design of the clam.. The clamshell form factor is most closely associated with the cell phone market, as Motorola used to have a trademark on the term "flip phone", [1] but the term "flip phone" has become genericized to be used more frequently than "clamshell" in colloquial speech.
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A leadless chip carrier (LCC) has no "leads", but instead has rounded pins through the edges of the ceramic or molded plastic package. Prototypes and devices intended for extended temperature environments are typically packaged in ceramic, while high-volume products for consumer and commercial markets are typically packaged in plastic.
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