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In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
Flat no-lead packages usually, but not always, include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad. [2] The QFN package is similar to the quad-flat package (QFP), and a ball grid array (BGA).
Thermally conductive pad: As opposed to previous TIMs that come in a fluidic form, thermal pads are manufactured and used in a solid state (albeit often soft). Mostly made of silicone or silicone-like material, thermal pads have the advantage of being easy to apply. They provide thicker bond lines (ranging in thickness from larger than a few ...
A thermal relief pad, thermal pad or simply thermal, is a printed circuit board (PCB) pad connected to a copper pour using a thermal connection. It looks like a normal pad with copper "spokes" connecting it to the surrounding copper. A typical pad on a printed circuit board is only connected to a few narrow tracks. A pad directly connected to ...
A block of metal with a corresponding flat surface and finned construction, sometimes with an attached fan, is clamped to the component. To fill poorly conducting air gaps due to imperfectly flat and smooth surfaces, a thin layer of thermal grease, a thermal pad, or thermal adhesive may be placed between the component and heatsink.
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