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Tantalum carbide, TaC, like the more commonly used tungsten carbide, is a hard ceramic that is used in cutting tools. Tantalum(III) nitride is used as a thin film insulator in some microelectronic fabrication processes.
The first tantalum electrolytic capacitors with wound tantalum foils and non-solid electrolyte were developed in 1930 by Tansitor Electronic Inc. (US), and were used for military purposes. [ 21 ] Solid electrolyte tantalum capacitors were invented by Bell Laboratories in the early 1950s as a miniaturized and more reliable low-voltage support ...
Tantalum carbide is widely used as sintering additive in ultra-high temperature ceramics (UHTCs) or as a ceramic reinforcement in high-entropy alloys (HEAs) due to its excellent physical properties in melting point, hardness, elastic modulus, thermal conductivity, thermal shock resistance, and chemical stability, which makes it a desirable ...
The mineral group tantalite [(Fe, Mn)Ta 2 O 6] is the primary source of the chemical element tantalum, a corrosion (heat and acid) resistant metal.It is chemically similar to columbite, and the two are often grouped together as a semi-singular mineral called coltan or "columbite-tantalite" in many mineral guides.
The niobium-dominant mineral in coltan is columbite (after niobium's original American name columbium), and the tantalum-dominant mineral is tantalite. [1] Tantalum from coltan is used to manufacture tantalum capacitors which are used for mobile phones, personal computers, automotive electronics, and cameras. [2]
Tantalum is one of the most corrosion-resistant substances available. Many important uses have been found for tantalum owing to this property, particularly in the medical and surgical fields, and also in harsh acidic environments. It is also used to make superior electrolytic capacitors.
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Tantalum nitride (TaN) is a chemical compound, a nitride of tantalum.There are multiple phases of compounds, stoichimetrically from Ta 2 N to Ta 3 N 5, including TaN.. As a thin film TaN find use as a diffusion barrier and insulating layer between copper interconnects in the back end of line of computer chips.