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The cathodic process results in considerably more gas being trapped within the film than the anodic process. Since the gas has a higher electrical resistance than either depositing film or the bath itself, the amount of gas has a significant effect on the current at a given applied voltage. This is why cathodic processes are often able to be ...
Chemical Bath Deposition has a long history but until recently was an uncommon method of thin-film deposition. [1]In 1865, Justus Liebig published an article describing the use of Chemical Bath Deposition to silver mirrors (to affix a reflective layer of silver to the back of glass to form a mirror), [5] though in the modern day electroplating and vacuum deposition are more common.
Electroplating, also known as electrochemical deposition or electrodeposition, is a process for producing a metal coating on a solid substrate through the reduction of cations of that metal by means of a direct electric current.
The electroless deposition and electroplating bath actively performs cathodic and anodic reactions at the surface of the substrate. [2] [3] The standard electrode potential of the metal and reducing agent are important as a driving force for electron exchange. [3] The standard potential is defined as the power of reduction of compounds.
Pages in category "Thin film deposition" The following 59 pages are in this category, out of 59 total. ... Cathodic arc deposition; Chemical bath deposition;
Cathodic arc deposition or Arc-PVD is a physical vapor deposition technique in which an electric arc is used to vaporize material from a cathode target. The vaporized material then condenses on a substrate, forming a thin film. The technique can be used to deposit metallic, ceramic, and composite films.
Alkaline cyanide baths have historically been one of the most commonly-used plating chemistries for copper electrodeposition. [5] [8] Cyanide copper baths typically provide high covering and throwing power, allowing uniform and complete coverage of the substrate, but often plate at lower current efficiency. [2]
During 1954–1959, a team led by Gregorie Gutzeit at General American Transportation Corporation greatly developed the process, determining the optimum parameters and concentrations of the bath, and introducing many important additives to speed up the deposition rate and prevent unwanted reactions, such as spontaneous deposition. They also ...