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Intel i945GC northbridge with Pentium Dual-Core microprocessor. This article provides a list of motherboard chipsets made by Intel, divided into three main categories: those that use the PCI bus for interconnection (the 4xx series), those that connect using specialized "hub links" (the 8xx series), and those that connect using PCI Express (the 9xx series).
A CPU socket is made of plastic, and often comes with a lever or latch, and with metal contacts for each of the pins or lands on the CPU. Many packages are keyed to ensure the proper insertion of the CPU. CPUs with a PGA (pin grid array) package are inserted into the socket and, if included, the latch is closed.
It is concluded that motherboards with the Knoll Activator would be built with I/O from the processor and low-cost I/O chips. [ 19 ] Individual chipset models differ in the number of PCI Express lanes, USB ports, and SATA connectors, as well as supported technologies; the table below shows these differences.
In 2020, AMD faced some criticism when it was announced on May 7 that its Zen 3-based Ryzen 5000 microprocessors would only be compatible with newer 500-series chipset AM4 motherboards. [ 41 ] [ 42 ] [ 43 ] This was explained as motherboard BIOS's sizes not being large enough to support the full range of AM4 socket processors.
VIA chipsets support CPUs from Intel, AMD (e.g. the Athlon 64) and VIA themselves (e.g. the VIA C3 or C7).They support CPUs as old as the i386 in the early 1990s. In the early 2000s, their chipsets began to offer on-chip graphics support from VIA's joint venture with S3 Graphics beginning in 2001; this support continued into the early 2010s, with the release of the VX11H in August 2012.
Comparison of the form factors for motherboards ATX, μATX (micro-ATX), DTX, mini-ITX and mini-DTX The DTX form factor is a variation of ATX specification [1] designed especially for small form factor PCs (especially for HTPCs) with dimensions of 8 × 9.6 inches (203 × 244 mm). [2]
For example, the introduction of AGP and, more recently, PCI Express have influenced motherboard design. However, the standardized size and layout of motherboards have changed much more slowly and are controlled by their own standards. The list of components required on a motherboard changes far more slowly than the components themselves.
The rear panel aperture is identical to the EEB and ATX specification and expansion cards mounted on an SSI CEB motherboard appear much the same as they would on an ATX motherboard. To standardize thermal behavior, processor position is defined, including primary and secondary processor identification.
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