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In electronics, a wafer (also called a slice or substrate) [1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon
Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in a semiconductor device fabrication process. Examples include production of radio frequency amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer ...
Wafering is the process by which a silicon crystal is made into wafers.This process is usually carried out by a multi-wire saw which cuts multiple wafers from the same crystal at the same time.
Wafer metrology equipment/tools, or wafer inspection tools are used to verify that the wafers haven't been damaged by previous processing steps up until testing; if too many dies on one wafer have failed, the entire wafer is scrapped to avoid the costs of further processing.
A die can host many types of circuits. One common use case of an integrated circuit die is in the form of a Central Processing Unit (CPU). Through advances in modern technology, the size of the transistor within the die has shrunk exponentially, following Moore's Law. Other uses for dies can range from LED lighting to power semiconductor devices.
The BEOL process deposits metalization layers on the silicion to interconnect the individual devices generated during FEOL (bottom). CMOS fabrication process. Back end of the line or back end of line (BEOL) is a process in semiconductor device fabrication that consists of depositing metal interconnect layers onto a wafer already patterned with devices.
Illustration of FEOL (device generation in the silicon, bottom) and BEOL (depositing metalization layers, middle part) to connect the devices. CMOS fabrication process. The front end of line (FEOL) is the first portion of IC fabrication where the individual components (transistors, capacitors, resistors, etc.) are patterned in a semiconductor substrate. [1]
In consequence a significant fraction of Si-OH (silanol) groups start to polymerize at room temperature forming Si-O-Si and water and a sufficient bonding strength for handling the wafer stack is assured. The formed water molecules will migrate or diffuse along the interface during annealing. [8]