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The continuous time (CT) blocks are composed of an op-amp circuit and designated as ACBxx where xx is 00–03. The other type is the switch cap (SC) blocks, which allow complex analog signal flows and are designated by ASCxy where x is the row and y is the column of the analog block.
5 W audio power amplifier (fixed 34 dB gain) [44] LM1875 20 W audio power amplifier (up to 90 dB gain) [45] LM1876 Dual 20 W audio power amplifier with Mute and Standby Modes (up to 90 dB gain) [46] LM386: Low voltage audio power amplifier [47] LM389 Yes Low voltage audio power amplifier (same as LM386) with 3 NPN transistors LM3875: Yes
The number of leads is always even. For 0.3 inch spacing, typical lead counts are 8, 14, 16, and 20; less common are 4, 6, 18, 24, and 28 lead counts. To have an even number of leads some DIPs have unused not connected (NC) [nb 1] leads to the internal chip, or are duplicated, e.g. two ground pins. For 0.6 inch spacing, typical lead counts are ...
8 channels for 4 operators, an additional ADPCM channel [89] Yamaha YMU762 (a.k.a. MA-3) 2001 64 32 2 Some 2000s cellphones, PDAs: 16 channels for 4 operators, 8 additional PCM/ADPCM channels [90] Yamaha YMU765 (a.k.a. MA-5) 2003 64 32 2 Some 2000s cellphones, PDAs: 32 PCM/ADPCM channels, 16 channels for 4 operators [91] Yamaha YMF825 (a.k.a ...
A reference designator unambiguously identifies the location of a component within an electrical schematic or on a printed circuit board.The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15.
The following is a list of CMOS 4000-series digital logic integrated circuits.In 1968, the original 4000-series was introduced by RCA.Although more recent parts are considerably faster, the 4000 devices operate over a wide power supply range (3V to 18V recommended range for "B" series) and are well suited to unregulated battery powered applications and interfacing with sensitive analogue ...
A 4-layer HDI microvia PCB is equivalent in quality to an 8-layer through-hole PCB, so HDI technology can reduce costs. HDI PCBs are often made using build-up film such as ajinomoto build-up film, which is also used in the production of flip chip packages. [15] [16] Some PCBs have optical waveguides, similar to optical fibers built on the PCB. [17]
Size comparison of BJT transistor packages, from left to right: SOT-23, TO-92, TO-126, TO-3 3D model of TO-3 package. In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits.