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AMD support Year introduced Introduced with Rendering Computing / ROCm; Vulkan [1] OpenGL [2] Direct3D HSA OpenCL; Wonder: Fixed-pipeline [a] 1000 nm 800 nm — — — — — Ended 1986 Graphics Solutions Mach: 800 nm 600 nm 1991 Mach8 3D Rage: 500 nm 5.0 1996 3D Rage Rage Pro: 350 nm 1.1 6.0 1997 Rage Pro Rage 128: 250 nm 1.2 1998 Rage 128 ...
Model – The marketing name for the GPU assigned by AMD/ATI. Note that ATI trademarks have been replaced by AMD trademarks starting with the Radeon HD 6000 series for desktop and AMD FirePro series for professional graphics. Codename – The internal engineering codename for the GPU. Launch – Date of release for the GPU.
CDNA (Compute DNA) is a compute-centered graphics processing unit (GPU) microarchitecture designed by AMD for datacenters. Mostly used in the AMD Instinct line of data center graphics cards, CDNA is a successor to the Graphics Core Next (GCN) microarchitecture; the other successor being RDNA (Radeon DNA), a consumer graphics focused microarchitecture.
ROCm [3] is an Advanced Micro Devices (AMD) software stack for graphics processing unit (GPU) programming. ROCm spans several domains: general-purpose computing on graphics processing units (GPGPU), high performance computing (HPC), heterogeneous computing.
The main AMD GPU software stacks are fully supported on Linux: GPUOpen for graphics, and ROCm for compute. GPUOpen is most often merely a supplement, for software utilities, to the free Mesa software stack that is widely distributed and available by default on most Linux distributions .
AMD is showing off its latest AI PC and graphics chips at CES 2025 in Las Vegas.The company on Monday announced its new Ryzen AI Max, additional Ryzen AI 300, and Ryzen AI 200 central processing ...
As of July 2017, the Graphics Core Next instruction set has seen five iterations. The differences between the first four generations are rather minimal, but the fifth-generation GCN architecture features heavily modified stream processors to improve performance and support the simultaneous processing of two lower-precision numbers in place of a single higher-precision number.
Zen 5 was designed with both 4nm and 3nm processes in mind. This acted as an insurance policy for AMD in the event that TSMC's mass production of its N3 nodes were to face delays, significant wafer defect issues or capacity issues.