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Adhesive bonding with organic materials such as BCB or SU-8 has simple process properties and the ability to form high-aspect ratio micro structures. The bonding procedure is based on polymerization reaction of organic molecules to form long polymer chains during annealing. This cross-link reaction forms BCB and SU-8 to a solid polymer layer. [3]
The SCImago Journal Rank (SJR) indicator is a measure of the prestige of scholarly journals that accounts for both the number of citations received by a journal and the prestige of the journals where the citations come from.
Journal ranking is widely used in academic circles in the evaluation of an academic journal's impact and quality. Journal rankings are intended to reflect the place of a journal within its field, the relative difficulty of being published in that journal, and the prestige associated with it.
The impact factor (IF) or journal impact factor (JIF) of an academic journal is a scientometric index calculated by Clarivate that reflects the yearly mean number of citations of articles published in the last two years in a given journal, as indexed by Clarivate's Web of Science.
The IEEE Transactions on Semiconductor Manufacturing is a quarterly peer-reviewed scientific journal published by the IEEE. It covers research on semiconductor device fabrication, including simulation and modeling from the factory to the detailed process level, defect control, yield analysis and optimization, production planning and scheduling, environmental issues in semiconductor ...
The classification is annually updated and follows a series of criteria defined by CAPES, such as: number of issues, indexation, number of publishing institutions, impact factor based on JCR, etc. The grades (so called "strata") occur in a 1–8 scale (A1, the highest; A2; B1; B2; B3; B4; B5; C — not listed). [1]
Adhesive bonding is a joining technique used in the manufacture and repair of a wide range of products. Along with welding and soldering, adhesive bonding is one of the basic joining processes. In this technique, components are bonded together using adhesives. The broad range of types of adhesives available allows numerous materials to be ...
The success or failure of the bond is based on measuring the applied force, the failure type due to the applied force and the visual appearance of the residual medium used. A development in bond strength testing of adhesively bonded composite structures is laser bond inspection (LBI). LBI provides a relative strength quotient derived from the ...