Search results
Results from the WOW.Com Content Network
The PVD process can be carried out at lower deposition temperatures and without corrosive products, but deposition rates are typically lower. Electron-beam physical vapor deposition, however, yields a high deposition rate from 0.1 to 100 μm/min at relatively low substrate temperatures, with very high material utilization efficiency. The ...
Sputter deposition: a glow plasma discharge (usually localized around the "target" by a magnet) bombards the material sputtering some away as a vapor for subsequent deposition. Pulsed electron deposition: a highly energetic pulsed electron beam ablates material from the target generating a plasma stream under nonequilibrium conditions.
Thin-film deposition is the overarching technology from which PVD, CVD, ALD, EBPVD, and EPVD are derived, each employing different methods to achieve specific coating characteristics. PVD (Physical Vapor Deposition) involves the physical vaporization of material in a vacuum to form a thin film, while EBPVD (Electron Beam Physical Vapor ...
Electron-beam machining is a process in which high-velocity electrons are concentrated into a narrow beam with a very high planar power density. The beam cross-section is then focused and directed toward the work piece, creating heat and vaporizing the material. Electron-beam machining can be used to accurately cut or bore a wide variety of metals.
Electron-beam-induced deposition (EBID) is a process of decomposing gaseous molecules by an electron beam leading to deposition of non-volatile fragments onto a nearby substrate. The electron beam is usually provided by a scanning electron microscope , which results in high spatial accuracy (potentially below one nanometer) and the possibility ...
Topological insulators can be grown using different methods such as metal-organic chemical vapor deposition (MOCVD), [67] physical vapor deposition (PVD), [68] solvothermal synthesis, [69] sonochemical technique [70] and molecular beam epitaxy. Schematic of the components of a MBE system (MBE). [34] MBE has so far been the most common ...
The main ionisation mechanism is electron impact, which is balanced by charge exchange, diffusion, and plasma ejection in flares. The ionisation rates depend on the plasma density. The ionisation degree of the metal vapour is a strong function of the peak current density of the discharge.
When the vapor source is a liquid or solid, the process is called physical vapor deposition (PVD), [3] which is used in semiconductor devices, thin-film solar panels, and glass coatings. [4] When the source is a chemical vapor precursor, the process is called chemical vapor deposition (CVD).