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A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography.
While they are used for many purposes, their most common use is for computer networking where it may be called a premises wire distribution room (PWD room). Many types of network connections place limits on the distance between end user equipment, such as personal computers , and network access devices, such as routers .
Major components on a PICMG 1.3 active backplane Wire-wrapped backplane from a 1960s PDP-8 minicomputer. A backplane or backplane system is a group of electrical connectors in parallel with each other, so that each pin of each connector is linked to the same relative pin of all the other connectors, forming a computer bus.
Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common. Wire ...
CAI—Computer-aided instruction; CAM—Computer-aided manufacturing; CAP—Consistency availability partition tolerance (theorem) CAPTCHA—Completely automated public Turing test to tell computers and humans apart; CAT—Computer-aided translation; CAQ—Computer-aided quality assurance; CASE—Computer-aided software engineering; cc—C compiler
The action caused by an impulse on a wire depended on when in the cycle it occurred, a simple form of time-division multiplexing. Thus an impulse that occurred during 7-time on a wire connected to the column 26 punch magnet would punch a hole in row 7 of column 26. An impulse on the same wire that occurred at 4-time would punch a 4 in column 26.
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