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  2. Transient liquid phase diffusion bonding - Wikipedia

    en.wikipedia.org/wiki/Transient_liquid_phase...

    Transient liquid phase diffusion bonding is a process that differs from diffusion bonding. In transient liquid phase diffusion bonding, an element or alloy with a lower melting point in an interlayer diffuses into the lattice and grain boundaries of the substrates at the bonding temperature. Solid state diffusional processes lead to a change of ...

  3. Liquid phase sintering - Wikipedia

    en.wikipedia.org/wiki/Liquid_phase_sintering

    Liquid phase sintering is a sintering technique that uses a liquid phase to accelerate the interparticle bonding of the solid phase. In addition to rapid initial particle rearrangement due to capillary forces, mass transport through liquid is generally orders of magnitude faster than through solid, enhancing the diffusional mechanisms that drive densification. [1]

  4. Template:Table of phase transitions - Wikipedia

    en.wikipedia.org/wiki/Template:Table_of_phase...

    Main page; Contents; Current events; Random article; About Wikipedia; Contact us; Pages for logged out editors learn more

  5. Molecularly imprinted polymer - Wikipedia

    en.wikipedia.org/wiki/Molecularly_imprinted_polymer

    A molecularly imprinted polymer (MIP) is a polymer that has been processed using the molecular imprinting technique which leaves cavities in the polymer matrix with an affinity for a chosen "template" molecule. The process usually involves initiating the polymerization of monomers in the presence of a template molecule that is extracted ...

  6. Diffusion bonding - Wikipedia

    en.wikipedia.org/wiki/Diffusion_bonding

    The diffusion bonding method can be used widely, joining either similar or dissimilar materials, and is also important in processing composite materials. The process is not extremely hard to approach and the cost to perform the diffusion bonding is not high. [14] The material under diffusion is able to reduce the plastic deformation.

  7. Direct bonding - Wikipedia

    en.wikipedia.org/wiki/Direct_bonding

    Direct bonding, or fusion bonding, is a wafer bonding process without any additional intermediate layers. It is based on chemical bonds between two surfaces of any material possible meeting numerous requirements. [1] These requirements are specified for the wafer surface as sufficiently clean, flat and smooth.

  8. Thermocompression bonding - Wikipedia

    en.wikipedia.org/wiki/Thermocompression_bonding

    The bonding temperature can be lowered using a higher applied pressure and vice versa, considering that high pressure increases the chances of damage to the structural material or the films. [8] The bonding process itself takes place in a vacuum or forming gas environment, e.g. N 2. [10]

  9. Template:Periodic table (simple substance bonding) - Wikipedia

    en.wikipedia.org/wiki/Template:Periodic_table...

    Metallic Network covalent Molecular covalent Single atoms Unknown Background color shows bonding of simple substances in the periodic table. If there are several, the most stable allotrope is considered.