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On June 9, 2022, AMD held their Financial Analyst Day where they presented a client GPU roadmap which contained mention of RDNA 3 coming in 2022 and RDNA 4 coming in 2024. [1] AMD announced to investors their intention to achieve a performance-per-watt uplift of over 50% with RDNA 3 and that the upcoming architecture would be built using ...
Two AMD Ryzen 9000 series microprocessors with Zen 5 architecture. Zen 5 is the name for a CPU microarchitecture by AMD, shown on their roadmap in May 2022, [3] launched for mobile in July 2024 and for desktop in August 2024. [4] It is the successor to Zen 4 and is currently fabricated on TSMC's N4X process. [5]
But competition was bound to emerge, and Advanced Micro Devices (NASDAQ: AMD) has stepped up to the plate with an exciting GPU roadmap. The company hosted its "Advancing AI" event on Oct. 10 ...
RDNA 2 is a GPU microarchitecture designed by AMD, released with the Radeon RX 6000 series on November 18, 2020. Alongside powering the RX 6000 series, RDNA 2 is also featured in the SoCs designed by AMD for the PlayStation 5 , Xbox Series X/S , and Steam Deck consoles.
Lastly, keep in mind that AMD is also developing a successor GPU to the MI300 called the MI325X -- slated to launch in 2025. Moreover, the company's MI400 architecture is targeting a launch date ...
Over the past year, AMD has at times claimed the fastest AI accelerator and most powerful chip in the sprint for the top. While the race is far from over, a more powerful GPU allows more capable ...
Zen 6 is the name for an upcoming CPU microarchitecture from AMD, shown on their roadmap in July 2024. [1] [2] It is the successor to Zen 5 and is believed to use TSMC's 3 nm and 2 nm processes. Desktop processors will be codenamed "Medusa" under the Ryzen 10000 name, [3] while Epyc server processors will be codenamed "Venice". [4]
Launch – Date of release for the GPU. Architecture – The microarchitecture used by the GPU. Fab – Fabrication process. Average feature size of components of the GPU. Transistors – Number of transistors on the die. Die size – Physical surface area of the die. Core config – The layout of the graphics pipeline, in terms of functional ...