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The IPC-NC-349 format is the only IPC standard governing drill and routing formats. [5] XNC is a strict subset of IPC-NC-349, Excellon a big superset. Many indefinite NC files pick some elements of the IPC standard. [1] A digital rights managed copy of the specification is available from the IPC website, for a fee.
IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.
Early integrated circuits were packaged in ceramic flat packs, which the military used for many years for their reliability and small size. The other type of packaging used in the 1970s, called the ICP (Integrated Circuit Package), was a ceramic package (sometimes round as the transistor package), with the leads on one side, co-axially with the ...
Eurocard is an IEEE standard format for printed circuit board (PCB) cards that can be plugged together into a standard chassis which, in turn, can be mounted in a 19-inch rack. The chassis consists of a series of slotted card guides on the top and bottom, into which the cards are slid so they stand on end, like books on a shelf.
A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive ...
An insulation-displacement contact (IDC), also known as insulation-piercing contact (IPC), is an electrical connector designed to be connected to the conductor(s) of an insulated cable by a connection process which forces a selectively sharpened blade or blades through the insulation, bypassing the need to strip the conductors of insulation ...
The part of interest is mechanically separated from the printed circuit board (PCB) and inspected for the presence of dye. Any fracture surface or interface will have dye present, indicating the presence of cracks or open circuits. IPC-TM-650 Method 2.4.53 specifies a process for dye-n-pry. [1]
A Full-size Module is the most common, allowing up to 23.25 mm high components (from centerline of PCB). A Mid-size Module allows component heights maxed at 11.65 to 14.01 mm (depending on board location). A Compact Module allows only 8.18 mm.