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RPR FOM is listed in the NATO Modelling and Simulation Standards Profile AMSP-01. [2] The RPR FOM provides backwards compatibility with simulations using the Distributed Interactive Simulation (DIS) standard. It is standardized by Simulation Interoperability Standards Organization (SISO) as SISO-STD-001-2015. [3] The standard consists of two parts:
IPC is a global trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.
It relates to the packaging and handling precautions for some semiconductors. The MSL is an electronic standard for the time period in which a moisture sensitive device can be exposed to ambient room conditions (30 °C/85%RH at Level 1; 30 °C/60%RH at all other levels). Increasingly, semiconductors have been manufactured in smaller sizes.
SISO-STD-004-2004: Dynamic Link Compatible HLA API Standard for the HLA Interface Specification; SISO-STD-004.1-2004: Dynamic Link Compatible HLA API Standard for the HLA Interface Specification; SISO-STD-005-200X: Link 11 A/B; SISO-STD-006-200X: Commercial Off-the-Shelf (COTS) Simulation Package Interoperability (CSPI) SISO-STD-007-2008 ...
According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package.
In both JS-001-2012 and MIL-STD-883H the charged human body is modeled by a 100 pF capacitor and a 1500 ohm discharging resistance. During testing, the capacitor is fully charged to several kilovolts (2 kV, 4 kV, 6 kV and 8 kV are typical standard levels) and then discharged through the resistor connected in series to the device under test.
For what it's worth, the IPC (general industry and military standard) J-STD-001 Handbook says that ROM1 fluxes (Kester RA "44") do not need to be cleaned for class 1 electronics: consumer electronics that will not cause major loss of money or life if they fail.
Enables transmission of J-Series (TADIL-J) messages over IP-based protocols MIL-STD-6020 5616 Standard for data forwarding between tactical data systems employing Links 11/11B and tactical data systems employing Link 16 MIL-STD-6020, DoD Interoperability Standard: Data Forwarding between TDLs IJMS ECM Resistant Communication System (ERCS)