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The USB 3.0 specification is similar to USB 2.0, but with many improvements and an alternative implementation.Earlier USB concepts such as endpoints and the four transfer types (bulk, control, isochronous and interrupt) are preserved but the protocol and electrical interface are different.
USB 3.2, released in September 2017, [39] preserves existing USB 3.1 SuperSpeed and SuperSpeedPlus architectures and protocols and their respective operation modes, but introduces two additional SuperSpeedPlus operation modes (USB 3.2 Gen 1×2 and USB 3.2 Gen 2×2) with the new USB-C Fabric with signaling rates of 10 and 20 Gbit/s (raw data ...
Connectors are identical for USB 2.0 and USB 1.x. SuperSpeed (SS) rate of 5.0 Gbit/s. The written USB 3.0 specification was released by Intel and its partners in August 2008. The first USB 3.0 controller chips were sampled by NEC in May 2009, [4] and the first products using the USB 3.0 specification arrived in January 2010. [5]
The xHCI reduces the need for periodic device polling by allowing a USB 3.0 or later device to notify the host controller when it has data available to read, and moves the management of polling USB 2.0 and 1.1 devices that use interrupt transactions from the CPU-driven USB driver to the USB host controller.
The USB 3.x family has had the same technical notation retroactively added in the USB 3.1 and USB 3.2 specification versions. Though this shows common principles and the same generations refer to the same nominal speeds, "Gen A" does not have the same exact meaning in both USB 3.x and USB4 specifications.
The USB 3.x specifications require that all devices must operate down to 4.00 V at the device port. Unlike USB 2.0 and USB 3.2, USB4 does not define its own VBUS-based power model. Power for USB4 operation is established and managed as defined in the USB Type-C Specification and the USB PD Specification.
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