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The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock.
Lucienne Ryzen 5000 APU series (laptop) Mendocino Ryzen 7020 APU series (laptop) and Athlon 7020 APU series (laptop) Rome Epyc 7002 series (server) Zen 3 series CPUs and APUs (released 2020) Vermeer Ryzen 5000 series (desktop) Chagall Ryzen Threadripper 5000 series (desktop) Cezanne Ryzen 5000 series (desktop & laptop) Barceló Ryzen 5000 ...
Common features of Ryzen 5000 desktop APUs: Socket: AM4. All the CPUs support DDR4-3200 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 512 KB per core. All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. Includes integrated GCN 5th generation GPU.
Ryzen 3 PRO 2100GE [2] found in some OEM markets in limited quantities. Ryzen (/ ˈ r aɪ z ən / RY-zən) [3] is a brand [4] of multi-core x86-64 microprocessors, designed and marketed by AMD for desktop, mobile, server, and embedded platforms, based on the Zen microarchitecture.
Common features of Ryzen 5000 desktop CPUs: Socket: AM4. All the CPUs support DDR4-3200 in dual-channel mode.; All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
Common features of Ryzen 5000 (Cezanne) desktop CPUs: Socket: AM4. CPUs support DDR4-3200 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 512 KB per core. CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset. No integrated graphics. Fabrication process: TSMC 7FF.
As the first largely "ground up redesign" of the Zen CPU core since the architecture family's original release in early 2017 with Zen 1/Ryzen 1000, Zen 3 was a significant architectural improvement over its predecessors; having a very significant IPC increase of +19% over the prior Zen 2 architecture in addition to being capable of reaching higher clock speeds.
Zen 3 was released on November 5, 2020, [30] using a more matured 7 nm manufacturing process, powering Ryzen 5000 series CPUs and APUs [30] (codename "Vermeer" (CPU) and "Cézanne" (APU)) and Epyc processors (codename "Milan"). Zen 3's main performance gain over Zen 2 is the introduction of a unified CCX, which means that each core chiplet is ...
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