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Beyond the models used for RET and OPC, computational lithography attempts to improve chip manufacturability and yields such as by using the signature of the scanner to help improve accuracy of the OPC model: [8] polarization characteristics of the lens pupil, Jones matrix of the stepper lens, optical parameters of the photoresist stack ...
Photolithography (also known as optical lithography) is a process used in the manufacturing of integrated circuits. It involves using light to transfer a pattern onto a substrate, typically a silicon wafer. The process begins with a photosensitive material, called a photoresist, being applied to the substrate.
An illustration of OPC (Optical Proximity Correction). The blue Γ-like shape is what chip designers would like printed on a wafer, in green is the pattern on a mask after applying optical proximity correction, and the red contour is how the shape actually prints on the wafer (quite close to the desired blue target).
where n is an integer, λ is the wavelength of the light the zone plate is meant to focus and f is the distance from the center of the zone plate to the focus. When the zone plate is small compared to the focal length, this can be approximated as r n ≃ n λ f {\displaystyle r_{n}\simeq {\sqrt {n\lambda f}}}
Exposure to the light causes sections of the resist to either harden or soften, depending on the process. After exposure, the wafer is developed like photographic film, causing the photoresist to dissolve in certain areas according to the amount of light the areas received during exposure.
A first exposure of photoresist is transferred to an underlying hardmask layer. After the photoresist is removed following the hardmask pattern transfer, a second layer of photoresist is coated onto the sample and this layer undergoes a second exposure, imaging features in between the features patterned in the hardmask layer.
Extreme ultraviolet lithography (EUVL, also known simply as EUV) is a technology used in the semiconductor industry for manufacturing integrated circuits (ICs). It is a type of photolithography that uses 13.5 nm extreme ultraviolet (EUV) light from a laser-pulsed tin (Sn) plasma to create intricate patterns on semiconductor substrates.
Immersion lithography is a technique used in semiconductor manufacturing to enhance the resolution and accuracy of the lithographic process. It involves using a liquid medium, typically water, between the lens and the wafer during exposure.