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  2. Aluminium joining - Wikipedia

    en.wikipedia.org/wiki/Aluminium_joining

    Aluminium alloys are often used due to their high strength-to-weight ratio, corrosion resistance, low cost, high thermal and electrical conductivity.There are a variety of techniques to join aluminium including mechanical fasteners, welding, adhesive bonding, brazing, soldering and friction stir welding (FSW), etc. Various techniques are used based on the cost and strength required for the joint.

  3. Adhesive bonding - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding

    Adhesive bonding is a joining technique used in the manufacture and repair of a wide range of products. Along with welding and soldering, adhesive bonding is one of the basic joining processes. In this technique, components are bonded together using adhesives. The broad range of types of adhesives available allows numerous materials to be ...

  4. Liquid optically clear adhesive - Wikipedia

    en.wikipedia.org/.../Liquid_optically_clear_adhesive

    Liquid optically-clear adhesive (LOCA) is liquid-based bonding technology used in touch panels and display devices to bind the cover lens, plastic, or other optical materials to the main sensor unit or each other. These adhesives improve optical characteristics and durability. LOCA glue is often hardened using ultraviolet light.

  5. Impact glue - Wikipedia

    en.wikipedia.org/wiki/Impact_glue

    Impact glue, contact glue, contact cement, or neoprene glue is a type of solvent-based adhesive which may be used to bond materials such as plastics, laminates, and metal or wood veneers. [1] The term "contact glue" come from the practice of applying adhesive to both surfaces to be bonded; the surfaces are joined once the solvent in the ...

  6. Pressure-sensitive adhesive - Wikipedia

    en.wikipedia.org/wiki/Pressure-sensitive_adhesive

    Adhesives may be broadly divided in two classes: structural and pressure-sensitive. To form a permanent bond, structural adhesives harden via processes such as evaporation of solvent (for example, white glue), reaction with UV radiation (as in dental adhesives), chemical reaction (such as two part epoxy), or cooling (as in hot melt).

  7. Adhesive bonding of semiconductor wafers - Wikipedia

    en.wikipedia.org/wiki/Adhesive_bonding_of...

    Adhesive bonding with organic materials such as BCB or SU-8 has simple process properties and the ability to form high-aspect ratio micro structures. The bonding procedure is based on polymerization reaction of organic molecules to form long polymer chains during annealing. This cross-link reaction forms BCB and SU-8 to a solid polymer layer. [3]

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