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An RF power amplifier incorporating planar circuit structures. The amplifier on the left feeds its output into a set of planar transmission line filters in the centre. The third circuit block on the right is a circulator to protect the amplifier from accidental reflections of the power back from the antenna
Classification of materials based on permittivity ε r ″ / ε r ′ Current conduction Field propagation; 0: perfect dielectric lossless medium ≪ 1: low-conductivity material poor conductor
Rogers offers liquid cooling materials designed to dissipate large amounts of heat, and provide thermal management of high-power laser diodes and other heat-generating optical devices. The cooling structures are copper foil channels bonded into a tight block, with aluminum-nitride (AlN) isolation layers added for extra performance.
The role of the substrate in power electronics is to provide the interconnections to form an electric circuit (like a printed circuit board), and to cool the components. Compared to materials and techniques used in lower power microelectronics , these substrates must carry higher currents and provide a higher voltage isolation (up to several ...
Substrate is used in a converting process such as printing or coating to generally describe the base material onto which, e.g. images, will be printed. Base materials may include: plastic films or foils, release liner; textiles, plastic containers; any variety of paper (lightweight, heavyweight, coated, uncoated, paperboard, cardboard, etc ...
This surface could be used to produce new film or layers of material such as deposited coatings. It could be the base to which paint, adhesives, or adhesive tape is bonded. A typical substrate might be rigid such as metal, concrete, or glass, onto which a coating might be deposited. Flexible substrates are also used. [1]
The standard provides with the document kind classification code (DCC) a structured letter-code for the classification of any kind of document. A public access database IEC 61355 DB [ 3 ] is available in order to facilitate the individuation of the correct code to be applied to a document
BGA ICs assembled on a Memory module. The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) on which it is placed.