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The costs of creating new mask shop for 180 nm processes were estimated in 2005 as $40 million, and for 130 nm - more than $100 million. [26] The purchase price of a photomask, in 2006, could range from $250 to $100,000 [27] for a single high-end phase-shift mask. As many as 30 masks (of varying price) may be required to form a complete mask set.
Contrast is the difference from exposed portion to unexposed portion. The higher the contrast is, the more obvious the difference between exposed and unexposed portions would be. Sensitivity Sensitivity is the minimum energy that is required to generate a well-defined feature in the photoresist on the substrate, measured in mJ/cm 2. The ...
The difference between steppers and scanners is that, during exposure, a scanner moves the photomask and the wafer simultaneously, while a stepper only moves the wafer. Contact, proximity and projection Mask aligners preceded steppers [39] [40] and do not move the photomask nor the wafer during exposure and use masks that cover the entire wafer.
In semiconductor fabrication, a resist is a thin layer used to transfer a circuit pattern to the semiconductor substrate which it is deposited upon. A resist can be patterned via lithography to form a (sub)micrometer-scale, temporary mask that protects selected areas of the underlying substrate during subsequent processing steps.
photomask (optical mask) – an opaque plate with holes or transparencies that allow light to shine through in a defined pattern; photoresist – a light-sensitive material used in processes such as photolithography to form a patterned coating on a surface; pitch – the distance between the centers of repeated elements
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A variety of reticles, each appropriate for one stage in the process, are contained in a rack in the reticle loader, usually located at the upper front of the stepper. Before the wafer is exposed a reticle is loaded onto the reticle stage by a robot, where it is also very precisely aligned. Since the same reticle can be used to expose many ...
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