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2. Surface-mount technology - Wikipedia

   en.wikipedia.org/wiki/Surface-mount_technology

   Defective surface-mount components can be repaired by using soldering irons (for some connections) or a non-contact rework system. In most cases, a rework system is the better choice because SMD work with a soldering iron requires considerable skill and is not always feasible.

3. Wave soldering - Wikipedia

   en.wikipedia.org/wiki/Wave_soldering

   Wave soldering is used for both through-hole printed circuit assemblies, and surface mount. In the latter case, the components are glued onto the surface of a printed circuit board (PCB) by placement equipment, before being run through the molten solder wave. Wave soldering is mainly used in soldering of through hole components.

4. Soldering - Wikipedia

   en.wikipedia.org/wiki/Soldering

   Hand-soldering techniques require a great deal of skill for the fine-pitch soldering of surface-mount chip packages. In particular ball grid array (BGA) devices are notoriously difficult, if not impossible, to rework by hand.

5. Reflow soldering - Wikipedia

   en.wikipedia.org/wiki/Reflow_soldering

   Reflow soldering with long industrial convection ovens is the preferred method of soldering surface mount technology (SMT) components to a printed circuit board (PCB). Each segment of the oven has a regulated temperature, according to the specific thermal requirements of each assembly.

6. Flat no-leads package - Wikipedia

   en.wikipedia.org/wiki/Flat_no-leads_package

   Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate.

7. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and ...